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SPI-BUS, Kraftfahrzeuge, 4 kbit (512x8 Bit), EEPROM - BR25H040FVM-2C

BR25H040-2C ist ein serieller EEPROM der SPI-BUS-Schnittstellenmethode.

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Teilenummer
Status
Gehäuse
Einheitenmenge
Minimale Gehäusemenge
Gehäusetyp
RoHS
BR25H040FVM-2CTR Active MSOP8 3000 3000 Taping Ja
 
Spezifikationen:
Grade Automotive
I/F SPI BUS
Density [bit] 4K
Bit Format [Word x Bit] 512 x 8
Package MSOP8
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 125
Vcc(Min.)[V] 2.5
Vcc(Max.)[V] 5.5
Circuit Current (Max.)[mA] 4.0
Standby Current (Max.)[μA] 10.0
Write Cycle (Max.)[ms] 4.0
Input Frequency (Max.)[Hz] 10M
Endurance (Max.)[Cycle] 106
Data Retention (Max.)[Year] 40
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Eigenschaften:
  • ・ High speed clock action up to 10MHz (Max.)
    ・ Wait function by HOLDB terminal.
    ・ Part or whole of memory arrays settable as read only memory area by program.
    ・ 2.5V to 5.5V single power source action most suitable for battery use.
    ・ Page write mode useful for initial value write at factory shipment.
    ・ For SPI bus interface (CPOL, CPHA)=(0, 0), (1, 1)
    ・ Self-timed programming cycle.
    ・ Low Supply Current At write operation (5V) : 1.0mA (Typ.) At read operation (5V) : 1.0mA (Typ.) At standby operation (5V) : 0.1μA (Typ.)
    ・ Address auto increment function at read operation
    ・ Prevention of write mistake Write prohibition at power on. Write prohibition by command code (WRDI). Write prohibition by WPB pin. Write prohibition block setting by status registers (BP1, BP0). Prevention of write mistake at low voltage.
    ・ MSOP8, TSSOP-B8, SOP8, SOP-J8 Package
    ・ Data at shipment Memory array: FFh, status register BP1, BP0 : 0
    ・ More than 100 years data retention.
    ・ More than 1 million write cycles.
    ・ AEC-Q100 Qualified.
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IN VERBINDUNG STEHENDE PRODUKT
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TEILENUMMER Produktname Gehäuse Datenblatt Lieferbare Bestände
BR25H040F-2C SPI-BUS, Kraftfahrzeuge, 4 kbit (512x8 Bit), EEPROM SOP8   Kaufen
BR25H040FJ-2C SPI-BUS, Kraftfahrzeuge, 4 kbit (512x8 Bit), EEPROM SOP-J8   Kaufen
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Technische Daten
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.

Part Explanation

For ICs