RBLQ3LAM10TF (In Entwicklung)
100 V, 3 A, SOD-128 Hocheffiziente SBD mit Trench-MOS-Struktur für die Automobilindustrie

Der RBLQ3LAM10TF ist eine hocheffiziente Schottky-Diode, deren Design den Kompromiss zwischen niedrigem VF und niedrigem IR verbessert. Trotz seines niedrigen VF erreicht er einen stabilen Betrieb bei hohen Temperaturen. Ideal für Schaltnetzteile, Freilaufdioden und Verpolungsschutzanwendungen.

Data Sheet Kaufen
Data Sheet Kaufen

Produktdetails

 
Teilenummer | RBLQ3LAM10TFTR
Status | In Entwicklung
Gehäuse | PMDTM
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Configuration

Single

Package Code

SOD-128

Package Size [mm]

2.5x4.7 (t=1.05)

Mounting Style

Surface mount

Number of terminal

2

VRM[V]

100

Reverse Voltage VR[V]

100

Average Rectified Forward Current IO[A]

3.0

IFSM[A]

80.0

Forward Voltage VF(Max.)[V]

0.64

IF @ Forward Voltage [A]

3.0

Reverse Current IR(Max.)[mA]

0.03

VR @ Reverse Current[V]

100

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

175

Eigenschaften:

  • High reliability
  • Small power mold type
  • Low VF and low IR

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Characteristics Data

  • RBLQ3LAM10TF ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations