DAP236U
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Produktdetails

 
Teilenummer | DAP236UT106
Status | Aktiv
Gehäuse | UMD3
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Configuration

A-Common

Package Code

SOT-323

Package(JEITA)

SC-70

Package Size[mm]

2.0x2.1 (t=0.9)

Mounting Style

Surface mount

Number of terminal

3

Reverse Voltage VR[V]

35

Tj[°C]

125

Ct[pF]

1.2

VR @ Ct [V]

6

f @ Ct [MHz]

1

rF[Ω]

0.9

IF @ rF [mA]

2

f @ rF [MHz]

100

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

125

Eigenschaften:

・Sehr klein und geformt (UMD3)
・Höchst zuverlässig

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • DAP236U SPICE Model
  • DAP236U Thermal Model (lib)

2D/3D/CAD

  • UMD3 STEP Data

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations