RFN5TF8SFH
Diode mit kurzer Erholungszeit (Fast Recovery Diode) (entspricht AEC-Q101)

ROHM's schnelle Freilaufdioden sind extrem schnell, haben niedriges VF und eignen sich für die signifikante Effizienzsteigerung des Schaltnetzteils sowie die Verringerung von Schaltverlusten.

Data Sheet Kaufen
Data Sheet Kaufen
  • Design Tools  
  • Packaging & Qualität  
  • FAQs
  • Kontakt

Produktdetails

 
Teilenummer | RFN5TF8SFHC9
Status | Empfohlen
Gehäuse | TO-220NFM (2PIN)
Einheitenmenge | 1000
Minimale Gehäusemenge |
Gehäusetyp | Tube
RoHS | Ja

Spezifikationen:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Configuration

Single

Package Code

ITO-220AC

Package Size [mm]

10x15 (t=4.7)

Mounting Style

Leaded type

Number of terminal

2

VRM[V]

800

Reverse Voltage VR[V]

800

Average Rectified Forward Current IO[A]

5.0

IFSM[A]

60.0

Forward Voltage VF(Max.)[V]

2.1

IF @ Forward Voltage [A]

5.0

Reverse Current IR(Max.)[mA]

0.01

VR @ Reverse Current [V]

800

trr(Max.)[ns]

40

IF @ trr [mA]

500

IR @ trr [A]

1.0

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

・TO-220-Gehäuse
・Hohe Effizienz und Zuverlässigkeit
SHOW/HIDE COLUMNS
Liste neuer Produkte

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RFN5TF8SFH Thermal Model (lib)

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations