RF1601NS2D
Superschnelle Diode mit kurzer Erholungszeit

RF1601NS2D ist die Superschnelle Diode mit niedriger VF für die allgemeine Gleichrichtung.

Data Sheet Kaufen *
* Dieses Produkt entspricht der Standardqualifizierung.
Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.
Data Sheet Kaufen *
  • Design Tools  
  • Packaging & Qualität  
  • FAQs
  • Kontakt

Produktdetails

 
Teilenummer | RF1601NS2DTL
Status | Empfohlen
Gehäuse | TO-263S (D2PAK)
Einheitenmenge | 1000
Minimale Gehäusemenge | 1000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Configuration

C-Common

Package Code

TO-263S (D2PAK)

Package(JEITA)

SC-83

Mounting Style

Surface mount

Number of terminal

3

VRM[V]

200

Reverse Voltage VR[V]

200

Average Rectified Forward Current IO[A]

16.0

IFSM[A]

100.0

Forward Voltage VF(Max.)[V]

0.93

IF @ Forward Voltage [A]

8.0

Reverse Current IR(Max.)[mA]

0.01

VR @ Reverse Current [V]

200

trr(Max.)[ns]

30

IF @ trr [mA]

500

IR @ trr [A]

1.0

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Package Size [mm]

10.1x9 (t=4.7)

Eigenschaften:

  • Cathode common dual type
  • Low switching loss
  • Low VF
SHOW/HIDE COLUMNS
Liste neuer Produkte

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RF1601NS2D SPICE Model
  • RF1601NS2D Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations