RBR1VWM30ATF
Schottky-Diode für die Automobilindustrie mit niedrigem VF, 30 V, 1 A

Der RBR1VWM30ATF ist eine hochzuverlässige Schottky-Diode mit niedrigem VF, geeignet für universelle Gleichrichteranwendungen.

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  • Design Tools  
  • Packaging & Qualität  
  • FAQs
  • Kontakt

Produktdetails

 
Teilenummer | RBR1VWM30ATFTR
Status | Empfohlen
Gehäuse | PMDE
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Package Size [mm]

1.3x2.5 (t=1)

Mounting Style

Surface mount

Number of terminal

2

VRM[V]

30

Reverse Voltage VR[V]

30

Average Rectified Forward Current IO[A]

1.0

IFSM[A]

30.0

Forward Voltage VF(Max.)[V]

0.48

IF @ Forward Voltage [A]

1.0

Reverse Current IR(Max.)[mA]

0.05

VR @ Reverse Current[V]

30

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

  • High reliability
  • Small power mold type
  • Low VF
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Unterlagen

Application Note

  • Advantages of PMDE Compact Package with High Heat Dissipation for Automotive Schottky Barrier Diodes

Technische Artikel

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Basics of Thermal Resistance and Heat Dissipation
  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RBR1VWM30ATF SPICE Model
  • How to Create Symbols for PSpice Models
  • RBR1VWM30ATF Thermal Model

Characteristics Data

  • RBR1VWM30ATF ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations