Models
- DA228U SPICE Model
- DA228U Thermal Model (lib)
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMD3 STEP Data
Characteristics Data
- ESD Data
DA228U
DA228U
Schaltdiode
ROHM's Schaltdioden, inklusive der Diodenanordungen, sind in höchst zuverlässigen Verpackungen und als stabile Lieferanten für verschiedene Applikationen erhältlich.
Neue alternative Produkte sind möglicherweise verfügbar.
Data Sheet
Kaufen
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* Dieses Produkt entspricht der Standardqualifizierung.
Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.
Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.
Produktdetails
Spezifikationen:
Grade
Standard
Configuration
Series Connection
Package Code
SOT-323
Package(JEITA)
SC-70
Mounting Style
Surface mount
Number of terminal
3
VRM[V]
80
Reverse Voltage VR[V]
80
Average Rectified Forward Current IO[A]
0.1
IFM[A]
0.2
Isurge[mA]
300
Forward Voltage VF[V]
1.2
IF @ Forward Voltage [mA]
100.0
Reverse Current IR[µA]
0.01
VR @ Reverse Current [V]
80
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
Package Size [mm]
2x2.1 (t=1)
Eigenschaften:
・Sehr kleines geformtes Gehäuse (UMD3)・Höchst zuverlässig
Ressourcen entwerfen
Technische Artikel
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Design Tools
Models
- DA228U SPICE Model
- DA228U Thermal Model (lib)
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMD3 STEP Data
Characteristics Data
- ESD Data
Packaging & Qualität
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations