DAP202UM
Schaltdiode

ROHM's Schaltdioden, inklusive der Diodenanordungen, sind in höchst zuverlässigen Verpackungen und als stabile Lieferanten für verschiedene Applikationen erhältlich.

Neue alternative Produkte sind möglicherweise verfügbar.
Data Sheet Kaufen *
* Dieses Produkt entspricht der Standardqualifizierung.
Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.
Data Sheet Kaufen *
  • Design Tools  
  • Packaging & Qualität  
  • FAQs
  • Kontakt

Produktdetails

 
Teilenummer | DAP202UMTL
Status | Aktiv
Gehäuse | UMD3F
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Configuration

A-Common

Package Code

SOT-323FL

Package(JEITA)

SC-85

Package Size[mm]

2.0x2.1 (t=0.9)

Mounting Style

Surface mount

Number of terminal

3

VRM[V]

80

Reverse Voltage VR[V]

80

Average Rectified Forward Current IO[A]

0.1

IFM[A]

0.3

Isurge[mA]

4000

Forward Voltage VF[V]

1.2

IF @ Forward Voltage [mA]

100.0

Reverse Current IR[µA]

0.1

VR @ Reverse Current [V]

70

trr[ns]

4

IF @ trr [mA]

5

VR @ trr [V]

6.0

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

・Kleines geformtes Gehäuse (Flat-Lead-Struktur)
・Höchst zuverlässig
SHOW/HIDE COLUMNS
Liste neuer Produkte

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • DAP202UM SPICE Model
  • DAP202UM Thermal Model (lib)

2D/3D/CAD

  • UMD3F STEP Data

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations