DAP222ZM
80 V, 100 mA, SOT-723 , gemeinsame Anode, Schaltdiode mit hoher Schaltgeschwindigkeit

Der DAP222ZM ist eine Schaltdiode mit kleinem Gehäuse, geeignet für Hochgeschwindigkeits-Schalten.

Data Sheet Kaufen *
* Dieses Produkt entspricht der Standardqualifizierung.
Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.

Produktdetails

 
Teilenummer | DAP222ZMT2L
Status | Empfohlen
Gehäuse | VMD3
Einheitenmenge | 8000
Minimale Gehäusemenge | 8000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Configuration

A-Common

Package Code

SOT-723

Package(JEITA)

SC-105AA

Mounting Style

Surface mount

Number of terminal

3

VRM[V]

80

Reverse Voltage VR[V]

80

Average Rectified Forward Current IO[A]

0.1

IFM[A]

0.3

Isurge[mA]

4000

Forward Voltage VF[V]

1.2

IF @ Forward Voltage [mA]

100.0

Reverse Current IR[µA]

0.1

VR @ Reverse Current [V]

70

trr[ns]

4

IF @ trr [mA]

5

VR @ trr [V]

6.0

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Package Size [mm]

1.2x1.2 (t=0.55)

Eigenschaften:

  • High reliability
  • Small mold type
  • High speed switching

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • DAP222ZM SPICE Model
  • DAP222ZM Thermal Model (lib)
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • VMD3 3D STEP Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations