BR93G86FVT-3
Microwire-BUS 16 kbit (1024x16 Bit), EEPROM

BR93G86-3 ist ein serieller EEPROM der 3-reihigen seriellen Schnittstellenmethode.
Sie haben eine duale Organisation (16 Bit oder 8 Bit) und werden durch den Eingang von ORG PIN ausgewählt.

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Produktdetails

 
Teilenummer | BR93G86FVT-3GE2
Status | Empfohlen
Gehäuse | TSSOP-B8
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Series

BR93G-3

Grade

Standard

I/F

MicroWire BUS(3-Wire)

Density [bit]

16k

Bit Format [Word x Bit]

1k x 16 / 2k x 8

Package

TSSOP-B8

Package Size [mm]

3x6.4(t=1.2)

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.7

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

3.0

Standby Current (Max.)[μA]

2.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

3M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

40

Comment

Selectable the format(16bit or 8bit) by ORG-pin. Cu wire.

Eigenschaften:

・ 3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared)
・ Operations available at high speed 3MHz clock (4.5 V~5.5 V)
・ High speed write available (write time 5ms max.)
・ Same package and pin configuration from 1Kbit to 16Kbit
・ 1.7~5.5V single power source operation
・ Address auto increment function at read operation
・ Write mistake prevention function » Write prohibition at power on » Write prohibition by command code » Write mistake prevention function at low voltage
・ Self-timed programming cycle
・ Program condition display by READY / BUSY
・ Dual organization : by 16 bit (X16) or 8 bit (X8)
・ Compact package SOP8/SOP-J8/SSOP-B8/TSSOP-B8/MSOP8/ TSSOP-B8J/DIP-T8/VSON008X2030
・ More than 40 years data retention
・ More than 1 million write cycles
・ Initial delivery state all addresses FFFFh (X16) or FFh (X8)

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Design Tools

Models

  • BR93G86FVT-3 IBIS Model

2D/3D/CAD

  • TSSOP-B8 Footprint / Symbol

Packaging & Qualität

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)