2D/3D/CAD
- SOP8 Footprint / Symbol
- SOP8 3D STEP Data
BR25G1MF-3
BR25G1MF-3
SPI-BUS EEPROM
BR25G1MF-3 ist ein 1 Mbit serieller EEPROM der SPI-BUS-Schnittstelle.
Data Sheet
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Produktdetails
Spezifikationen:
Series
BR25G-3
Grade
Standard
I/F
SPI BUS
Density [bit]
1024k
Bit Format [Word x Bit]
128k x 8
Package
SOP8
Operating Temperature (Min.)[°C]
-40
Operating Temperature (Max.)[°C]
85
Vcc(Min.)[V]
1.8
Vcc(Max.)[V]
5.5
Circuit Current (Max.)[mA]
3.0
Standby Current (Max.)[μA]
10.0
Write Cycle (Max.)[ms]
5.0
Input Frequency (Max.)[Hz]
10M
Endurance (Max.)[Cycle]
106
Data Retention (Max.)[Year]
100
Eigenschaften:
- High Speed Clock Action up to 10MHz (Max)
- Wait Function by HOLDB Terminal
- Part or Whole of Memory Arrays Settable as Read only Memory Area by Program
- 1.8V to 5.5V Single Power Source Operation Most Suitable for Battery Use.
- Up to 256 Bytes in Page Write Mode.
- For SPI Bus Interface (CPOL, CPHA) = (0, 0), (1, 1)
- Self-timed Programming Cycle
- Low Current Consumption
- Address Auto Increment Function at Read Action
- Prevention of Write Mistake
- More than 100 years Data Retention.
- More than 1 Million Write Cycles.
- Bit Format 128K×8
Ressourcen entwerfen
Technische Artikel
Schematic Design & Verification
- Opcode, Address, and Page Configuration for SPI BUS EEPROM
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Thermal Resistance
Design Tools
2D/3D/CAD
- SOP8 Footprint / Symbol
- SOP8 3D STEP Data
Packaging & Qualität
Package Information
- Package Information
- Anti-Whisker formation
Manufacturing Data
- Factory Information
Environmental Data
- UL94 Flame Classifications of Mold Compound
- Compliance with the ELV directive
- REACH SVHC Non-use Declaration
- RoHS Comission Delegated Directive
Export Information
- The Export Control Order
- Export Administration Regulations(EAR)