BR25G320FVM-3
SPI-BUS EEPROM

BR25G320FVM-3 ist ein 32 kbit serieller EEPROM der SPI-BUS-Schnittstelle.

Data Sheet Kaufen *
* Dieses Produkt entspricht der Standardqualifizierung.
Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.

Produktdetails

 
Teilenummer | BR25G320FVM-3GTR
Status | Empfohlen
Gehäuse | MSOP8
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Series

BR25G-3

Grade

Standard

I/F

SPI BUS

Density [bit]

32k

Bit Format [Word x Bit]

4k x 8

Package

MSOP8

Package Size [mm]

2.9x4(t=0.9)

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.6

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

2.0

Standby Current (Max.)[μA]

0.1

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

20M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

100

Eigenschaften:

  • High Speed Clock Action up to 20MHz (Max)
  • Wait Function by HOLDB Terminal
  • Part or Whole of Memory Arrays Settable as Read only Memory Area by Program
  • 1.6V to 5.5V Single Power Source Operation Most Suitable for Battery Use.
  • Up to 32 Bytes in Page Write Mode.
  • For SPI Bus Interface (CPOL, CPHA) = (0, 0), (1, 1)
  • Self-timed Programming Cycle
  • Low Current Consumption
    • At Write Action (5V) : 0.5mA (Typ)
    • At Read Action (5V) : 2.0mA (Typ)
    • At Standby Action (5V) : 0.1µA (Typ)
  • Address Auto Increment Function at Read Action
  • Prevention of Write Mistake
    • Write Prohibition at Power On
    • Write Prohibition by Command Code (WRDI)
    • Write Prohibition by WPB Pin
    • Write Prohibition Block Setting by Status Registers (BP1, BP0)
    • Prevention of Write Mistake at Low Voltage
  • More than 100 years Data Retention.
  • More than 1 Million Write Cycles.
  • Bit Format 4K~8
  • Initial Delivery Data
    Memory Array: FFh
    Status Register: WPEN, BP1, BP0 : 0

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Opcode, Address, and Page Configuration for SPI BUS EEPROM
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Design Tools

2D/3D/CAD

  • MSOP8 Footprint / Symbol

Packaging & Qualität

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)