RF4E100AJ
Nch-Mittelleistungs-MOSFET 30 V 10 A

RF4E100AJ ist ein hochleistungsfähiges MOSFET-Paket (HUML2020L8) für Schaltungen und DC/DC-Wandler und Batterieschaltanwendungen.

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Produktdetails

 
Teilenummer | RF4E100AJTCR
Status | Empfohlen
Gehäuse | HUML2020L8 (Single)
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

DFN2020-8S

Package Size [mm]

2.0x2.0 (t=0.6)

Applications

Power Supply

Number of terminal

8

Polarity

Nch

Drain-Source Voltage VDSS[V]

30

Drain Current ID[A]

10.0

RDS(on)[Ω] VGS=2.5V(Typ.)

0.0133

RDS(on)[Ω] VGS=4.5V(Typ.)

0.0094

RDS(on)[Ω] VGS=Drive (Typ.)

0.0133

Total gate charge Qg[nC]

13.0

Power Dissipation (PD)[W]

2.0

Drive Voltage[V]

2.5

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

  • Low on - resistance.
  • High Power Small Mold Package (HUML2020L8).
  • Pb-free lead plating; RoHS compliant
  • Halogen Free
  • 100% Rg and UIS tested

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RF4E100AJ SPICE Model
  • RF4E100AJ Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations