Models
- RD3P130SP SPICE Model
- How to Create Symbols for PSpice Models
Characteristics Data
- RD3P130SP ESD Data
RD3P130SP
RD3P130SP
Pch -100V -13A Leistungs-MOSFET
Der RD3P130SP ist ein Leistungs-MOSFET mit niedrigem Durchlassiwderstand für Schaltanwendungen.
Data Sheet
Kaufen
*
* Dieses Produkt entspricht der Standardqualifizierung.
Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.
Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.
Produktdetails
Spezifikationen:
Grade
Standard
Package Code
TO-252 (DPAK)
Package Size [mm]
6.6x9.9 (t=2.4)
JEITA Package
SC-63
Number of terminal
3
Polarity
Pch
Drain-Source Voltage VDSS[V]
-100
Drain Current ID[A]
-13.0
RDS(on)[Ω] VGS=4V(Typ.)
0.155
RDS(on)[Ω] VGS=4.5V(Typ.)
0.15
RDS(on)[Ω] VGS=10V(Typ.)
0.135
RDS(on)[Ω] VGS=Drive (Typ.)
0.155
Total gate charge Qg[nC]
40.0
Power Dissipation (PD)[W]
20.0
Drive Voltage[V]
-4.0
Mounting Style
Surface mount
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
Eigenschaften:
- Low on-resistance.
- Fast switching speed.
- Drive circuits can be simple.
- Parallel use is easy.
- Pb-free plating ; RoHS compliant
Ressourcen entwerfen
Technische Artikel
Schematic Design & Verification
- Temperature derating method for Safe Operating Area (SOA)
- Calculation of Power Dissipation in Switching Circuit
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Thermocouples
- What is a Thermal Model? (Transistor)
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Design Tools
Models
- RD3P130SP SPICE Model
- How to Create Symbols for PSpice Models
Characteristics Data
- RD3P130SP ESD Data
Packaging & Qualität
Package Information
- Package Dimensions
- Inner Structure
- Moisture Sensitivity Level
- Anti-Whisker formation
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations