RQ3C150BC
Pch-Mittelleistungs-MOSFET -20 V -30 A

Der mittlere Leistungs MOSFET RQ3C150BC ist geeignet zum Schalten und Lastschalter.

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Produktdetails

 
Teilenummer | RQ3C150BCTB
Status | Empfohlen
Gehäuse | HSMT8
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

HSMT8 (3.3x3.3)

Package Size [mm]

3.3x3.3 (t=0.8)

Applications

Switching

Number of terminal

8

Polarity

Pch

Drain-Source Voltage VDSS[V]

-20

Drain Current ID[A]

-37.0

RDS(on)[Ω] VGS=1.8V(Typ.)

0.0088

RDS(on)[Ω] VGS=2.5V(Typ.)

0.0061

RDS(on)[Ω] VGS=4.5V(Typ.)

0.0048

RDS(on)[Ω] VGS=Drive (Typ.)

0.0088

Total gate charge Qg[nC]

60.0

Power Dissipation (PD)[W]

20.0

Drive Voltage[V]

1.8

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

  • Low on - resistance.
  • High Power Package (HSMT8).
  • Pb-free lead plating; RoHS compliant.
  • Halogen Free
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Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RQ3C150BC SPICE Model
  • RQ3C150BC Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations