RQ6G050AT (Neues Produkt)
Pch -40 V -5A Leistungs-MOSFET

Der RQ6G050AT ist ein MOSFET mit niedrigem Durchlasswiderstand für Schalt- und Lastschaltanwendungen.

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Produktdetails

 
Teilenummer | RQ6G050ATTCR
Status | Empfohlen
Gehäuse | TSMT6
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

SOT-457T

Package Size [mm]

2.9x2.8 (t=1)

JEITA Package

SC-95

Number of terminal

6

Polarity

Pch

Drain-Source Voltage VDSS[V]

-40

Drain Current ID[A]

-5.0

RDS(on)[Ω] VGS=4.5V(Typ.)

0.038

RDS(on)[Ω] VGS=10V(Typ.)

0.031

RDS(on)[Ω] VGS=Drive (Typ.)

0.038

Total gate charge Qg[nC]

11.0

Power Dissipation (PD)[W]

1.25

Drive Voltage[V]

-4.5

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

  • Low on - resistance
  • High Power small mold Package (TSMT6)
  • Pb-free plating ; RoHS compliant
  • Halogen Free
  • 100% Rg and UIS tested

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RQ6G050AT SPICE Model
  • RQ6G050AT Thermal Model

Characteristics Data

  • RQ6G050AT ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • TSMT6_TCR Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations