BD9A600MUV
2,7 V bis 5,5 V Eingangsleistung, 6 A Synchron-Buck-Wandler DC/DC-Wandler mit Integriertem Einzel-MOSFET

BD9A600MUV ist ein synchroner Abwärtsschaltregler mit integrierten Leistungs-MOSFETs mit niedrigem ON-Widerstand. Eine Stromstärke von bis zu 6 A ist möglich. Durch die SLLM™-Steuerung kann bei geringer Last ein hoher Wirkungsgrad erzielt werden. Dadurch ist das Produkt optimal für Ausrüstung und Geräte geeignet, für die ein minimaler Standby-Stromverbrauch erforderlich ist. Die Schwingungsfrequenz liegt mit 1 MHz hoch und weist einen kleinen Induktanzwert auf. Der DC/DC-Wandler zur Steuerung des Strommodus zeichnet sich durch ein Hochgeschwindigkeitseinschwingverhalten aus. Auch die Phasenkompensation ist leicht einstellbar.

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Produktdetails

 
Teilenummer | BD9A600MUV-E2
Status | Empfohlen
Gehäuse | VQFN016V3030
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

ch

1

Integrated FET / Controller

Integrated FET

Topology

Buck

Synchronous / Nonsynchronous

Synchronous

Vin1(Min.)[V]

2.7

Vin1(Max.)[V]

5.5

Vout1(Min.)[V]

0.8

Vout1(Max.)[V]

3.85

Iout1(Max.)[A]

6.0

SW frequency(Max.)[MHz]

1.0

Light Load mode

Yes

EN

Yes

PGOOD

Yes

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Eigenschaften:

  • Synchronous Single DC/DC Converter.
  • SLLM™(Simple Light Load Mode)Control.
  • Over Current Protection.
  • Short Circuit Protection.
  • Thermal Shutdown Protection.
  • Under Voltage Lockout Protection.
  • Adjustable Soft start Function.
  • Power Good Output.
  • VQFN016V3030 Package(Backside Heat Dissipation)

Evaluation
Board

 
    • Evaluation Board
    • BD9A600MUV-EVK-001
    • This evaluation board has been developed for ROHM’s synchronous buck DC/DC converter customers evaluating BD9A600MUV. While accepting a power supply of 2.7-5.5V, an output of 1.8V can be produced. The IC has internal 25mΩ high-side N-channel MOSFET and 25mΩ low-side N-channel MOSFET and a synchronization frequency is of 1MHz.

  • User's Guide Design Data Buy

Ressourcen entwerfen

 

Unterlagen

White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs

User's Guide

  • Evaluation Board User's Guide
  • Evaluation Board Data

Application Note

  • PCB Layout for BD9A Series

Reference Design

  • BD9A600MUV Reference Circuits and Bomlist

Technische Artikel

Schematic Design & Verification

  • Buck DC/DC Converter Recommended Inductor List
  • Calculation of Power Dissipation in Switching Circuit
  • Considering Input Filter to Reduce Conducted Emissions by DCDC Converter
  • Considering Polarity of Power Inductor to Reduce Radiated Emission of DC-DC converter
  • Method for Monitoring Switching Waveform
  • Phase Compensation Design for Current Mode Buck Converter
  • Bootstrap Circuit in the Buck Converter
  • Method for Determining Constants of
  • Power Supply Sequence Circuit with General Purpose Power Supply IC
  • Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter
  • PCB Layout Techniques of Buck Converter
  • Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)
  • Usage of SPICE Macromodel for DC/DC
  • Snubber Circuit for Buck Converter IC
  • Efficiency of Buck Converter
  • Calculation of Power Loss (Synchronous)
  • Inductor Calculation for Buck converter IC
  • Considerations for Power Inductors Used for Buck Converters
  • Capacitor Calculation for Buck converter IC
  • The Important Points of Multi-layer Ceramic Capacitor Used in Buck Converter circuit
  • Resistor Value Table to set Output Voltage of Buck Converter IC
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Thermal Resistance
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

2D/3D/CAD

  • VQFN016V3030 Footprint / Symbol
  • VQFN016V3030 3D STEP Data

Packaging & Qualität

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)