2SC4617FRA
NPN-Universal-Verstärkungstransistor (entspricht AEC-Q101)

Verschiedene Produkte werden in Produktreihen angeboten mit dem Fokus auf Aspekten wie Energieeinsparung und Zuverlässigkeit als die wesentlichen Konzepte, wobei die Gehäuse von ultrakompakten Typen bis zu Leistungstypen reichen, um die Anforderungen des Marktes zu erfüllen.

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Produktdetails

 
Teilenummer | 2SC4617FRATL
Status | Empfohlen
Gehäuse | EMT3
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Package Code

SOT-416

Package Size [mm]

1.6x1.6 (t=0.7)

JEITA Package

SC-75A

Number of terminal

3

Polarity

NPN

Collector Power dissipation PC[W]

0.15

Collector-Emitter voltage VCEO1[V]

50.0

Collector current Io(Ic) [A]

0.15

hFE

120 to 390

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

· Universell einsetzbar
· Kleines, oberflächenmontierbares Gehäuse
· Bleifrei/RoHS-konform
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Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • 2SC4617FRA SPICE Model
  • 2SC4617FRA Thermal Model (lib)
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • EMT3 3D STEP Data

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations