Models
- 2SCR523UB SPICE Model
- 2SCR523UB Thermal Model (lib)
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMT3F STEP Data
Characteristics Data
- ESD Data
2SCR523UB
2SCR523UB
NPN-Universal-Verstärkungstransistor
Verschiedene Produkte werden in Produktreihen angeboten mit dem Fokus auf Aspekten wie Energieeinsparung und Zuverlässigkeit als die wesentlichen Konzepte, wobei die Gehäuse von ultrakompakten Typen bis zu Leistungstypen reichen, um die Anforderungen des Marktes zu erfüllen.
Data Sheet
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* Dieses Produkt entspricht der Standardqualifizierung.
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Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.
Produktdetails
Spezifikationen:
Grade
Standard
Package Code
SOT-323FL
Package Size [mm]
2.0x2.1 (t=0.9)
JEITA Package
SC-85
Number of terminal
3
Polarity
NPN
Collector-Emitter voltage VCEO1[V]
50.0
Collector current Io(Ic) [A]
0.1
hFE
120 to 560
hFE (Min.)
120
hFE (Max.)
560
Mounting Style
Surface mount
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
Eigenschaften:
· Universell einsetzbar· Kleines, oberflächenmontierbares Gehäuse
· Bleifrei/RoHS-konform
Ressourcen entwerfen
Technische Artikel
Schematic Design & Verification
- Temperature derating method for Safe Operating Area (SOA)
- Calculation of Power Dissipation in Switching Circuit
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Transistor)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Design Tools
Models
- 2SCR523UB SPICE Model
- 2SCR523UB Thermal Model (lib)
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMT3F STEP Data
Characteristics Data
- ESD Data
Packaging & Qualität
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List - Please contact us by filling in the form.
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations