QSX8
NPN+NPN-Treibertransistor

Geräte mit zwei integrierten Transistoren sind in extrem kompakten Gehäusen verfügbar. Sie sind für verschiedene Anwendungen geeignet wie beispielsweise für differentielle Vorverstärker-Verstärkungsschaltungen, Hochfrequenz-Oszillatoren, Treiber-ICs usw.

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Produktdetails

 
Teilenummer | QSX8TR
Status | Empfohlen
Gehäuse | TSMT6
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

SOT-457T

Package Size [mm]

2.9x2.8 (t=1.0)

JEITA Package

SC-95

Number of terminal

6

Polarity

NPN+NPN

Collector-Emitter voltage VCEO1[V]

30.0

Collector current Io(Ic) [A]

1.0

Collector-Emitter voltage VCEO2[V]

30.0

Collector current(continuous) IC2[A]

1.0

hFE

270 to 680

hFE (Min.)

270

hFE (Max.)

680

Mounting Style

Surface mount

Equivalent (Single Part)

2SD2675 / 2SD2675

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

· Kompakter komplexer Leistungsbipolartransistor
· Für Treiber
· Kleines, oberflächenmontierbares Gehäuse
· Bleifrei/RoHS-konform
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Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • QSX8 SPICE Model
  • QSX8 Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • QSX8 ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • TSMT6_TR Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations