UMB4NFHA
PNP+PNP-Digitaltransistor (entspricht AEC-Q101)

Geräte mit zwei integrierten Transistoren sind in extrem kompakten Gehäusen verfügbar. Sie sind für verschiedene Anwendungen geeignet wie beispielsweise für differentielle Vorverstärker-Verstärkungsschaltungen, Hochfrequenz-Oszillatoren, Treiber-ICs usw.

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Produktdetails

 
Teilenummer | UMB4NFHATN
Status | Empfohlen
Gehäuse | UMT6
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Package Code

SOT-363

Package Size [mm]

2.0x2.1 (t=0.9)

JEITA Package

SC-88

Number of terminal

6

Polarity

PNP+PNP

Supply voltage VCC 1[V]

-50.0

Collector current Io (Ic) [A]

-0.1

Input resistance R1 1[kΩ]

10.0

Input resistance R1 2[kΩ]

10.0

Collector-Emitter voltage VCEO1[V]

-50.0

Collector current Io(Ic) [A]

-0.1

Collector-Emitter voltage VCEO2[V]

-50.0

Collector current(continuous) IC2[A]

-0.1

Power Dissipation (PD)[W]

0.15

Mounting Style

Surface mount

Equivalent (Single Part)

DTA114T / DTA114T

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

· Ultrakompakter komplexer Digitaltransistor
· Mit Eingangswiderstand
· Kleines, oberflächenmontierbares Gehäuse
· Bleifrei/RoHS-konform
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Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

2D/3D/CAD

  • UMT6 STEP Data

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations