DTC114GU3
NPN 100mA 50V Digitaltransistor (Vorwiderstand integrierter Transistor)

Der DTC114GU3 ist ein digitaler Transistor (Transistor mit eingebautem Widerstand). Eingebaute Vorwiderstände ermöglichen die Konfiguration einer Wechselrichterschaltung, ohne externe Eingangswiderstände anzuschließen.

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Produktdetails

 
Teilenummer | DTC114GU3T106
Status | Empfohlen
Gehäuse | UMT3
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

SOT-323

Package Size [mm]

2x2.1 (t=1)

JEITA Package

SC-70

Number of terminal

3

Polarity

NPN

Supply voltage VCC 1[V]

50.0

Collector current Io (Ic) [A]

0.1

Emitter base Resistance R2 1 [kΩ]

10.0

Collector-Emitter voltage VCEO1[V]

50.0

Collector current Io(Ic) [A]

0.1

Power Dissipation (PD)[W]

0.2

Mounting Style

Surface mount

GI hFE

30 to

Output Current [A]

0.1

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

  • Built-In Biasing Resistor
  • Built-in bias resistors enable the configuration of an inverter circuit without connecting external input resistors (see inner circuit) .
  • Complementary PNP Types: DTA114G series
  • Lead Free/RoHS Compliant.
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Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • DTC114GU3 SPICE Model
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • UMT3 STEP Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations