Models
- DTD123YC SPICE Model
- How to Create Symbols for PSpice Models
2D/3D/CAD
- SOT-23 STEP Data
Characteristics Data
- ESD Data
DTD123YC
DTD123YC
Digitaltransistor (eingebaute Widerstände)
DTD123YC ist ein digitaler Transistor (Transistor mit eingebauten Widerständen). Die Vorspannungswiderstände bestehen aus Dünnschichtwiderständen mit vollständiger Isolation, um negative Spannung zu ermöglichen.
Data Sheet
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Produktdetails
Spezifikationen:
Grade
Standard
Package Code
SOT-23
Package Size [mm]
2.9x2.4 (t=0.95)
Number of terminal
3
Polarity
NPN
Supply voltage VCC 1[V]
50.0
Collector current Io (Ic) [A]
0.5
Input resistance R1 1 [kΩ]
2.2
Emitter base Resistance R2 1 [kΩ]
10.0
Collector-Emitter voltage VCEO1[V]
50.0
Collector current Io(Ic) [A]
0.5
Power Dissipation (PD)[W]
0.2
Mounting Style
Surface mount
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
Eigenschaften:
- 1)Built-in bias resistors enable the configuration of an inverter circuit without connecting external input resistors.(see equivalent circuit)
- 2)The bias resistors consist of thin-film resistors with complete isolation to allow negative
- biasing of the input. They also have the advantage of almost completely eliminating parasitic effects.
- 3)Only the on/off conditions need to be set for operation, making the device desigh easy.
Ressourcen entwerfen
Technische Artikel
Schematic Design & Verification
- Temperature derating method for Safe Operating Area (SOA)
- Calculation of Power Dissipation in Switching Circuit
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Thermocouples
- What is a Thermal Model? (Transistor)
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Design Tools
Models
- DTD123YC SPICE Model
- How to Create Symbols for PSpice Models
2D/3D/CAD
- SOT-23 STEP Data
Characteristics Data
- ESD Data
Packaging & Qualität
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations