Models
- EMG8 SPICE Model
- How to Create Symbols for PSpice Models
2D/3D/CAD
- EMT5 3D STEP Data
Characteristics Data
- ESD Data
EMG8
EMG8
NPN+NPN-Digitaltransistor (mit integrierten Widerständen)
Geräte mit zwei integrierten Transistoren sind in extrem kompakten Gehäusen verfügbar. Sie sind für verschiedene Anwendungen geeignet wie beispielsweise für differentielle Vorverstärker-Verstärkungsschaltungen, Hochfrequenz-Oszillatoren, Treiber-ICs usw.
Data Sheet
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Produktdetails
Spezifikationen:
Grade
Standard
Package Code
SOT-553
Package Size [mm]
1.6x1.6 (t=0.55)
JEITA Package
SC-107BB
Number of terminal
5
Polarity
NPN+NPN
Supply voltage VCC 1[V]
50.0
Collector current Io (Ic) [A]
0.1
Input resistance R1 1 [kΩ]
4.7
Emitter base Resistance R2 1 [kΩ]
47.0
Supply voltage VCC 2[V]
50.0
Collector current IC 2[A]
0.1
Input resistance R1 2 [kΩ]
4.7
Emitter base Resistance R2 2 [kΩ]
47.0
Power Dissipation (PD)[W]
0.15
Mounting Style
Surface mount
Equivalent (Single Part)
DTC143Z / DTC143Z
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
Eigenschaften:
· Ultrakompakter komplexer Digitaltransistor· Integrierte Vorspannungswiderstände
· Mit Spannungsteiler
· Kleines, oberflächenmontierbares Gehäuse
· Bleifrei/RoHS-konform
Ressourcen entwerfen
Technische Artikel
Schematic Design & Verification
- Temperature derating method for Safe Operating Area (SOA)
- Calculation of Power Dissipation in Switching Circuit
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Thermocouples
- What is a Thermal Model? (Transistor)
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Design Tools
Models
- EMG8 SPICE Model
- How to Create Symbols for PSpice Models
2D/3D/CAD
- EMT5 3D STEP Data
Characteristics Data
- ESD Data
Packaging & Qualität
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations