RF04UA2D
Diode mit kurzer Erholungszeit (Fast Recovery Diode)

ROHM's schnelle Freilaufdioden sind extrem schnell, haben niedriges VF und eignen sich für die signifikante Effizienzsteigerung des Schaltnetzteils sowie die Verringerung von Schaltverlusten.

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Produktdetails

 
Teilenummer | RF04UA2DTR
Status | Aktiv
Gehäuse | TSMD6
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Configuration

Dual Line (Alt.)

Package Code

SOT-457T

Package(JEITA)

SC-95

Package Size[mm]

2.9x2.8 (t=1.0)

Mounting Style

Surface mount

Number of terminal

6

VRM[V]

200

Reverse Voltage VR[V]

200

Average Rectified Forward Current IO[A]

0.4

IFSM[A]

1.0

Forward Voltage VF(Max.)[V]

0.98

IF @ Forward Voltage [A]

0.2

Reverse Current IR(Max.)[mA]

0.01

VR @ Reverse Current [V]

200

trr(Max.)[ns]

25

IF @ trr [mA]

500

IR @ trr [A]

1.0

Storage Temperature (Min.)[°C]

-40

Storage Temperature (Max.)[°C]

150

Eigenschaften:

・Klein und geformt (TSMD6)
・Schnelles Schalten und hohe Zuverlässigkeit

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RF04UA2D SPICE Model
  • RF04UA2D Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations