RF2001NS3D
Diode mit kurzer Erholungszeit (Fast Recovery Diode)

ROHM's schnelle Freilaufdioden sind extrem schnell, haben niedriges VF und eignen sich für die signifikante Effizienzsteigerung des Schaltnetzteils sowie die Verringerung von Schaltverlusten.

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Produktdetails

 
Teilenummer | RF2001NS3DTL
Status | Empfohlen
Gehäuse | TO-263S (D2PAK)
Einheitenmenge | 1000
Minimale Gehäusemenge | 1000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Configuration

C-Common

Package Code

TO-263S (D2PAK)

Package(JEITA)

SC-83

Mounting Style

Surface mount

Number of terminal

3

VRM[V]

350

Reverse Voltage VR[V]

300

Average Rectified Forward Current IO[A]

20.0

IFSM[A]

100.0

Forward Voltage VF(Max.)[V]

1.3

IF @ Forward Voltage [A]

10.0

Reverse Current IR(Max.)[mA]

0.01

VR @ Reverse Current [V]

300

trr(Max.)[ns]

25

IF @ trr [mA]

500

IR @ trr [A]

1.0

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Package Size [mm]

10.1x9 (t=4.7)

Eigenschaften:

・Typ Power Mold
・Sehr geringe Energierückgewinnung

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RF2001NS3D SPICE Model
  • RF2001NS3D Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations