RB168VYM-40FH
40V, 1A, Schottky-Diode (entspricht AEC-Q101)

RB168VYM-40FH ist die sehr zuverlässige Schottky-Diode für Automobilanwendungen, geeignet für die allgemeine Gleichrichtung.

Data Sheet Kaufen
Data Sheet Kaufen
  • Design Tools  
  • Packaging & Qualität  
  • FAQs
  • Kontakt

Produktdetails

 
Teilenummer | RB168VYM-40FHTR
Status | Empfohlen
Gehäuse | TUMD2M
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Configuration

Single

Package Code

SOD-323HE

Package Size [mm]

2.5x1.4 (t=0.6)

Package(JEITA)

SC-108B

Mounting Style

Surface mount

Number of terminal

2

VRM[V]

40

Reverse Voltage VR[V]

40

Average Rectified Forward Current IO[A]

1.0

IFSM[A]

5.0

Forward Voltage VF(Max.)[V]

0.79

IF @ Forward Voltage [A]

1.0

Reverse Current IR(Max.)[mA]

5.0E-4

VR @ Reverse Current[V]

40

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

  • Small mold type (TUMD2M)
  • High reliability
  • Super low IR
SHOW/HIDE COLUMNS
Liste neuer Produkte

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RB168VYM-40FH SPICE Model
  • RB168VYM-40FH Thermal Model (lib)
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • TUMD2M STEP Data

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations