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It can be effective to change to the same product or one with similar characteristics in a larger package with higher power loss. Or if the package cannot be changed, the permissible loss can be increased by making the area of the copper foil connected to the backside heat radiating pad as large as possible, increasing the thickness of the copper foil, or using copper foil for the inner layer of the multilayer substrate. There is also a method for improving the heat sink in screw stop package products. Refer to the technical materials for details on backside heat dissipation and heat sink.
