SML-H12P8T
SML-H12P8T
EXCELED™-Serie Chip-LED
ROHM's Chip-LED-Aufstellung beinhaltet die Standardausführung, Obenansicht, Seitenansicht und Inversmontage.
Produktdetails
Spezifikationen:
Package Type
Mini-mold
LED Type
Standard
Package size[mm]
2.0x1.25 (t=0.8)
Emitting color
Green
Luminous Intensity(Single)(Typ.)[mcd]
4.0
Number of Brightness Rank
3
Dominant wave-length λD(Single)(Typ.)[nm]
560.0
Forward Voltage VF (Typ.) [V]
2.2
IF @ VF [mA]
20
Chip Structure
AlGaInP
Power Dissipation [mW]
54
Operating Temperature[°C]
-40 to 85
Storage Temperature [°C]
-40 to 100
Eigenschaften:
・0805(20125mm) size・surface mount chip LED
Ressourcen entwerfen
Unterlagen
White Paper
Technische Artikel
Schematic Design & Verification
- About LED Devices
- How to read LED characteristics data
- About LED Package
- About LED Parallel Circuits
- Relationship between Recommended LED Soldering Pattern and Solder Amount
- Electrostatic Breakdown of LEDs
- Chromaticity Classification of LEDs in RGB Color Mixing
- Degradation of luminous intensity of blue and white products due to long-term use of LEDs
- Relationship between LED Chip Position and Directivity
- About LED Optical Unit
- The relationship between LED luminous intensity and luminous flux
- LED Manual
Thermal Design
Design Tools
Models
- SML-H12P8T SPICE Model
- SML-H12P8T Ray Data
2D/3D/CAD
- SML-H12P8T 3D STEP Data
- Parasolid X_T File
- 3D eDrawings Data