BR93G56F-3B
Microwire-BUS 2 kbit (128x16 Bit), EEPROM

BR93G56-3B ist ein serieller EEPROM der 3-reihigen seriellen Schnittstellenmethode.
Sie haben eine 16 Bit-Organisation, und CS PIN ist der dritte PIN in ihrer PIN-Konfiguration.

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Produktdetails

 
Teilenummer | BR93G56F-3BGTE2
Status | Empfohlen
Gehäuse | SOP8
Einheitenmenge | 2500
Minimale Gehäusemenge | 2500
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Series

BR93G-3B

Grade

Standard

I/F

MicroWire BUS(3-Wire)

Density [bit]

2k

Bit Format [Word x Bit]

128 x 16

Package

SOP8

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.7

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

3.0

Standby Current (Max.)[μA]

2.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

3M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

40

Comment

Pin rotated type. Cu wire bonding.

Eigenschaften:

・ 3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared)
・ Actions available at high speed 3MHz clock (4.5V ~ 5.5V)
・ High speed write available (write time 5ms max.)
・ Same package and pin layout from 1Kbit to 16Kbit
・ 1.7~5.5V single power source action
・ Address auto increment function at read action
・ Write mistake prevention function » Write prohibition at power on » Write prohibition by command code » Write mistake prevention function at low voltage
・ Program cycle auto delete and auto end function
・ Program condition display by READY / BUSY
・ Compact package SOP8/SOP-J8/SSOP-B8/TSSOP-B8/MSOP8/ TSSOP-B8J/DIP-T8/VSON008X2030
・ Data retention for 40 years
・ Data rewrite up to 1,000,000 times
・ Data at shipment all addresses FFFFh

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Thermal Resistance

Design Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

2D/3D/CAD

  • SOP8 Footprint / Symbol
  • SOP8 3D STEP Data

Packaging & Qualität

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)