RJU003N03FRA
2,5 V Antriebs-Nch-MOSFET (entspricht AEC-Q101)

MOSFETs sind so entwickelt, dass sie durch einen sehr niedrigen Einschaltwiderstand mithilfe von Mikrobearbeitungstechnologien für mobile Ausrüstung mit niedrigem Stromverbrauch geeignet sind. Das breit aufgestellte Sortiment umfasst kompakte, hochleistungsfähige und komplexe Ausführungen, um Marktbedürfnisse zu erfüllen.

Produktdetails

 
Teilenummer | RJU003N03FRAT106
Status | Empfohlen
Gehäuse | UMT3
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Package Code

SOT-323

Package Size [mm]

2x2.1 (t=1)

JEITA Package

SC-70

Number of terminal

3

Polarity

Nch

Drain-Source Voltage VDSS[V]

30

Drain Current ID[A]

0.3

RDS(on)[Ω] VGS=2.5V(Typ.)

1.4

RDS(on)[Ω] VGS=4V(Typ.)

0.9

RDS(on)[Ω] VGS=4.5V(Typ.)

0.8

RDS(on)[Ω] VGS=Drive (Typ.)

1.4

Power Dissipation (PD)[W]

0.2

Drive Voltage[V]

2.5

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

· 2,5-V-Motor
· N-Kanal-Kleinsignal-MOSFET
· Kleines, oberflächenmontierbares Gehäuse
· Bleifrei/RoHS-konform

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RJU003N03FRA SPICE Model
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • UMT3 STEP Data

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations