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- RJU003N03FRA SPICE Model
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMT3 STEP Data
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RJU003N03FRA
RJU003N03FRA
2,5 V Antriebs-Nch-MOSFET (entspricht AEC-Q101)
MOSFETs sind so entwickelt, dass sie durch einen sehr niedrigen Einschaltwiderstand mithilfe von Mikrobearbeitungstechnologien für mobile Ausrüstung mit niedrigem Stromverbrauch geeignet sind. Das breit aufgestellte Sortiment umfasst kompakte, hochleistungsfähige und komplexe Ausführungen, um Marktbedürfnisse zu erfüllen.
Produktdetails
Spezifikationen:
Grade
Automotive
Common Standard
AEC-Q101 (Automotive Grade)
Package Code
SOT-323
Package Size [mm]
2x2.1 (t=1)
JEITA Package
SC-70
Number of terminal
3
Polarity
Nch
Drain-Source Voltage VDSS[V]
30
Drain Current ID[A]
0.3
RDS(on)[Ω] VGS=2.5V(Typ.)
1.4
RDS(on)[Ω] VGS=4V(Typ.)
0.9
RDS(on)[Ω] VGS=4.5V(Typ.)
0.8
RDS(on)[Ω] VGS=Drive (Typ.)
1.4
Power Dissipation (PD)[W]
0.2
Drive Voltage[V]
2.5
Mounting Style
Surface mount
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
Eigenschaften:
· 2,5-Ｖ-Motor· N-Kanal-Kleinsignal-MOSFET
· Kleines, oberflächenmontierbares Gehäuse
· Bleifrei/RoHS-konform
Ressourcen entwerfen
Technische Artikel
Schematic Design & Verification
- Temperature derating method for Safe Operating Area (SOA)
- Calculation of Power Dissipation in Switching Circuit
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Thermocouples
- What is a Thermal Model? (Transistor)
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Design Tools
Models
- RJU003N03FRA SPICE Model
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMT3 STEP Data
Characteristics Data
- ESD Data
Packaging & Qualität
Package Information
- Package Dimensions
- Taping Information
- Explanation for Marking
- Condition of Soldering
- Moisture Sensitivity Level
- Anti-Whisker formation
Environmental Data
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations