RSJ400N06FRA
10 V Antriebs-Nch-MOSFET (entspricht AEC-Q101)

MOSFETs mit Leistung sind so entwickelt, dass sie durch einen niedrigen Einschaltwiderstand mithilfe von Mikrobearbeitungstechnologien für eine Vielzahl von Anwendungen geeignet sind. Das breit aufgestellte Sortiment umfasst kompakte, hochleistungsfähige und komplexe Ausführungen, um unterschiedliche Marktbedürfnisse zu erfüllen.

Produktdetails

 
Teilenummer | RSJ400N06FRATL
Status | Empfohlen
Gehäuse | LPTS (D2PAK)
Einheitenmenge | 1000
Minimale Gehäusemenge | 1000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Package Code

TO-263 (D2PAK)

Package Size [mm]

10.1x13.1 (t=4.5)

JEITA Package

SC-83

Number of terminal

3

Polarity

Nch

Drain-Source Voltage VDSS[V]

60

Drain Current ID[A]

40.0

RDS(on)[Ω] VGS=10V(Typ.)

0.011

RDS(on)[Ω] VGS=Drive (Typ.)

0.011

Total gate charge Qg[nC]

52.0

Power Dissipation (PD)[W]

50.0

Drive Voltage[V]

10.0

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

· 10-V-Motor
· N-Kanal-Leistungs-MOSFET
· Schnelle Schaltgeschwindigkeit
· Einfache Motorschaltungen möglich
· Einfache parallele Verwendung
· Bleifrei/RoHS-konform

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RSJ400N06FRA SPICE Model
  • RSJ400N06FRA Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations