R6035ENZ
Nch 600V 35A Leistungs-MOSFET mit niedrigem Rauschen

Die R6xxxENx-Serie sind rauscharme Super Junction MOSFETs, bei denen die einfache Handhabung im Vordergrund steht. Die Produkte dieser Serie erreichen eine hervorragende Leistung für rauschempfindliche Anwendungen zur Reduzierung des Rauschens, wie z.B. Audio- und Beleuchtungsgeräte.

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Produktdetails

 
Teilenummer | R6035ENZC17
Status | Empfohlen
Gehäuse | TO-3PF
Einheitenmenge | 300
Minimale Gehäusemenge | 30
Gehäusetyp | Tube
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

TO-3PF

Package Size [mm]

15.5x26.5 (t=5.7)

Applications

Power Supply

Number of terminal

3

Polarity

Nch

Drain-Source Voltage VDSS[V]

600

Drain Current ID[A]

35.0

RDS(on)[Ω] VGS=10V(Typ.)

0.092

RDS(on)[Ω] VGS=Drive (Typ.)

0.092

Total gate charge Qg[nC]

110.0

Power Dissipation (PD)[W]

120.0

Drive Voltage[V]

10.0

Trr (Typ.)[ns]

780

Mounting Style

Leaded type

Bare Die Part Number

Available: K7406

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

  • Low on-resistance
  • Fast switching speed
  • Gate-source voltage (VGSS) guaranteed to be ±20V
  • Drive circuits can be simple
  • Parallel use is easy
  • Pb-free lead plating ; RoHS compliant

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • R6035ENZ SPICE Model
  • R6035ENZ Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations