QH8MC5 (Neues Produkt)
60V 3.0A/3.5A, Dual Nch+Pch, TSMT8, Small Signal MOSFET

QH8MC5 is Nch + Pch dual MOSFET which supports 60V withstand voltage. This is designed for 24V input equipments such as factory automation equipments, and motors mounted on base stations (cooling fans). It contains ROHM's ultra-low on-resistance Nch / Pch MOSFETs in one package. By combining the optimum Nch + Pch, you can reduce the design efforts. It also contributes to lower power consumption of equipment.

Data Sheet Kaufen *
* Dieses Produkt entspricht der Standardqualifizierung.
Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.

Produktdetails

 
Teilenummer | QH8MC5TCR
Status | Empfohlen
Gehäuse | TSMT8
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

TSMT8

Package Size[mm]

3.0x2.8 (t=0.8)

Number of terminal

8

Polarity

Nch+Pch

Drain-Source Voltage VDSS[V]

60

Drain Current ID[A]

3.0

RDS(on)[Ω] VGS=4.5V(Typ.)

0.1

RDS(on)[Ω] VGS=10V(Typ.)

0.07

RDS(on)[Ω] VGS=Drive (Typ.)

0.1

Total gate charge Qg[nC]

1.7

Power Dissipation (PD)[W]

1.5

Drive Voltage[V]

4.5

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

  • Low on-resistance
  • Small Surface Mount Package (TSMT8)
  • Pb-free lead plating ; RoHS compliant
  • Halogen Free

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • How to Create Symbols for PSpice Models
  • QH8MC5 SPICE Model
  • QH8MC5 Thermal Model

Packaging & Qualität

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations