RQ3E070BN
Nch-Mittelleistungs-MOSFET 30 V 7 A

RQ3E070BN ist ein Hochleistungsgehäuse (HSMT8) MOSFET für die Schaltfunktion.

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Produktdetails

 
Teilenummer | RQ3E070BNTB1
Status | Empfohlen
Gehäuse | HSMT8
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

HSMT8 (3.3x3.3)

Package Size [mm]

3.3x3.3 (t=0.8)

Applications

Switching, Motor

Number of terminal

8

Polarity

Nch

Drain-Source Voltage VDSS[V]

30

Drain Current ID[A]

15.0

RDS(on)[Ω] VGS=4.5V(Typ.)

0.029

RDS(on)[Ω] VGS=10V(Typ.)

0.02

RDS(on)[Ω] VGS=Drive (Typ.)

0.029

Total gate charge Qg[nC]

4.6

Power Dissipation (PD)[W]

13.0

Drive Voltage[V]

4.5

Mounting Style

Surface mount

Bare Die Part Number

Available: K4009

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

・ Low on - resistance.
・ High Power Package (HSMT8).
・ Pb-free lead plating ; RoHS compliant
・ Halogen Free

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RQ3E070BN SPICE Model
  • RQ3E070BN Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations