RQ3E080BN
Nch-Mittelleistungs-MOSFET 30 V 8 A

MOSFETs mit Leistung sind so entwickelt, dass sie durch einen niedrigen Einschaltwiderstand mithilfe von Mikrobearbeitungstechnologien für eine Vielzahl von Anwendungen geeignet sind. Das breit aufgestellte Sortiment umfasst kompakte, hochleistungsfähige und komplexe Ausführungen, um unterschiedliche Marktbedürfnisse zu erfüllen.

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Produktdetails

 
Teilenummer | RQ3E080BNTB
Status | Aktiv
Gehäuse | HSMT8
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

HSMT8 (3.3x3.3)

Package Size [mm]

3.3x3.3 (t=0.8)

Applications

Switching, Motor

Number of terminal

8

Polarity

Nch

Drain-Source Voltage VDSS[V]

30

Drain Current ID[A]

15.0

RDS(on)[Ω] VGS=4.5V(Typ.)

0.016

RDS(on)[Ω] VGS=10V(Typ.)

0.011

RDS(on)[Ω] VGS=Drive (Typ.)

0.016

Total gate charge Qg[nC]

7.2

Power Dissipation (PD)[W]

14.0

Drive Voltage[V]

4.5

Mounting Style

Surface mount

Bare Die Part Number

Available: K4001

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

  • Low on - resistance.
  • High Power Package (HSMT8).
  • Pb-free lead plating; RoHS compliant.
  • Halogen Free

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RQ3E080BN SPICE Model
  • RQ3E080BN Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations