Simulations (Login Required)
- Method for Exporting Circuit Data (ROHM Solution Simulator)
Models
- RS1E170GN SPICE Model
- RS1E170GN Thermal Model (lib)
Characteristics Data
- RS1E170GN ESD Data
RS1E170GN
RS1E170GN
Nch-Leistungs-MOSFET 30 V 40 A
MOSFETs mit Leistung sind so entwickelt, dass sie durch einen niedrigen Einschaltwiderstand mithilfe von Mikrobearbeitungstechnologien für eine Vielzahl von Anwendungen geeignet sind. Das breit aufgestellte Sortiment umfasst kompakte, hochleistungsfähige und komplexe Ausführungen, um unterschiedliche Marktbedürfnisse zu erfüllen.
Data Sheet
Kaufen
*
* Dieses Produkt entspricht der Standardqualifizierung.
Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.
Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.
Produktdetails
Spezifikationen:
Grade
Standard
Package Code
HSOP8S (5x6)
Package Size[mm]
5.0x6.0 (t=1.0)
Applications
Power Supply
Number of terminal
8
Polarity
Nch
Drain-Source Voltage VDSS[V]
30
Drain Current ID[A]
40.0
RDS(on)[Ω] VGS=4.5V(Typ.)
0.0067
RDS(on)[Ω] VGS=10V(Typ.)
0.0051
RDS(on)[Ω] VGS=Drive (Typ.)
0.0067
Total gate charge Qg[nC]
5.9
Power Dissipation (PD)[W]
23.0
Drive Voltage[V]
4.5
Mounting Style
Surface mount
Bare Die Part Number
Available: K4501
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
Eigenschaften:
- Low on - resistance
- High Power Package (HSOP8)
- Pb-free lead plating; RoHS compliant
- Halogen Free
- 100% Rg and UIS Tested
Ressourcen entwerfen
Technische Artikel
Schematic Design & Verification
- Temperature derating method for Safe Operating Area (SOA)
- Calculation of Power Dissipation in Switching Circuit
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Transistor)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Design Tools
Simulations (Login Required)
- Method for Exporting Circuit Data (ROHM Solution Simulator)
Models
- RS1E170GN SPICE Model
- RS1E170GN Thermal Model (lib)
Characteristics Data
- RS1E170GN ESD Data
Packaging & Qualität
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Condition of Soldering
- Moisture Sensitivity Level
- Anti-Whisker formation
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations