RS1G300GN
Nch-Leistungs-MOSFET 40 V 80 A

Nch 40 V 30 A Power MOSFET für hocheffiziente DC/DC-Wandleranwendungen und Motortreiber

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Produktdetails

 
Teilenummer | RS1G300GNTB
Status | Empfohlen
Gehäuse | HSOP8 (Single)
Einheitenmenge | 2500
Minimale Gehäusemenge | 2500
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

HSOP8S (5x6)

Package Size[mm]

5.0x6.0 (t=1.0)

Applications

Power Supply

Number of terminal

8

Polarity

Nch

Drain-Source Voltage VDSS[V]

40

Drain Current ID[A]

80.0

RDS(on)[Ω] VGS=4.5V(Typ.)

0.0024

RDS(on)[Ω] VGS=10V(Typ.)

0.0019

RDS(on)[Ω] VGS=Drive (Typ.)

0.0024

Total gate charge Qg[nC]

28.6

Power Dissipation (PD)[W]

35.0

Drive Voltage[V]

4.5

Mounting Style

Surface mount

Bare Die Part Number

Available: K4724

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

  • Low on-resistance
  • High power package (HSOP8)
  • Pb-free lead plating ; RoHS compliant
  • Halogen free
  • 100% Rg and UIS tested

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

Models

  • RS1G300GN SPICE Model
  • RS1G300GN Thermal Model (lib)

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations