RQ5A030AP
Pch-Mittelleistungs-MOSFET -12 V -3 A

Die RQ5A03AP ist ein Hochleistungs-/Kleingehäuse-MOSFET für Schaltanwendungen.

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Produktdetails

 
Teilenummer | RQ5A030APTL
Status | Empfohlen
Gehäuse | TSMT3
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

SOT-346T

Package Size [mm]

2.9x2.8 (t=1)

JEITA Package

SC-96

Applications

Switching

Number of terminal

3

Polarity

Pch

Drain-Source Voltage VDSS[V]

-12

Drain Current ID[A]

-3.0

RDS(on)[Ω] VGS=1.5V(Typ.)

0.09

RDS(on)[Ω] VGS=1.8V(Typ.)

0.075

RDS(on)[Ω] VGS=2.5V(Typ.)

0.055

RDS(on)[Ω] VGS=4.5V(Typ.)

0.044

RDS(on)[Ω] VGS=Drive (Typ.)

0.09

Total gate charge Qg[nC]

16.0

Power Dissipation (PD)[W]

1.0

Drive Voltage[V]

-1.5

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

· Kleiner Durchlasswiderstand
· Kleines, oberflächenmontierbares Gehäuse (TSMT3)
· Bleifreier Leitungsüberzug, RoHS-konform
· Halogenfrei

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RQ5A030AP SPICE Model
  • RQ5A030AP Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations