RSM002P03
4 V Antriebs-Pch-MOSFET

MOSFETs sind so entwickelt, dass sie durch einen sehr niedrigen Einschaltwiderstand mithilfe von Mikrobearbeitungstechnologien für mobile Ausrüstung mit niedrigem Stromverbrauch geeignet sind. Das breit aufgestellte Sortiment umfasst kompakte, hochleistungsfähige und komplexe Ausführungen, um Marktbedürfnisse zu erfüllen.

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Produktdetails

 
Teilenummer | RSM002P03T2L
Status | Empfohlen
Gehäuse | VMT3
Einheitenmenge | 8000
Minimale Gehäusemenge | 8000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

SOT-723

Package Size [mm]

1.2x1.2 (t=0.5)

JEITA Package

SC-105AA

Number of terminal

3

Polarity

Pch

Drain-Source Voltage VDSS[V]

-30

Drain Current ID[A]

-0.2

RDS(on)[Ω] VGS=4V(Typ.)

1.6

RDS(on)[Ω] VGS=4.5V(Typ.)

1.4

RDS(on)[Ω] VGS=10V(Typ.)

0.9

RDS(on)[Ω] VGS=Drive (Typ.)

1.6

Power Dissipation (PD)[W]

0.15

Drive Voltage[V]

-4.0

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

· 4-V-Motor
· P-Kanal-Kleinsignal-MOSFET
· Kleines, oberflächenmontierbares Gehäuse
· Bleifrei/RoHS-konform

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • RSM002P03 SPICE Model
  • RSM002P03 Thermal Model (lib)
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • VMT3 3D STEP Data

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations