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BD16939AEFV-C
BD16939AEFV-C
6-Kanal-Halbbrückentreiber für die Automobilindustrie mit SPI-Steuerung
Der BD16939AEFV-C ist ein 6-Kanal-Halbbrückentreiber für Automobilanwendungen. Er kann kompakte DC-Bürstenmotoren direkt antreiben, und jeder Ausgang kann in drei Modi (Hoch-, Nieder- und Hochimpedanz) gesteuert werden. Die MCU kann den Treiber über eine serielle 16-Bit-SPI-Schnittstelle (Serial Peripheral Interface) steuern. Die absolute Spannung beträgt 40 V mit niedrigem Einschaltwiderstand, verpackt in einem kompakten Gehäuse, was zur Realisierung einer hohen Zuverlässigkeit, eines niedrigen Energieverbrauchs und niedriger Kosten beiträgt.
Produktdetails
Teilenummer | BD16939AEFV-CE2
Status |
Empfohlen
Gehäuse |
HTSSOP-B28
Einheitenmenge | 2500
Minimale Gehäusemenge | 2500
Gehäusetyp | Taping
RoHS |
Ja
Funktionalen Sicherheit:
Kategorie : FS supportive
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the functional safety.
Spezifikationen:
Grade
Automotive
Common Standard
AEC-Q100 (Automotive Grade)
Vcc (Max.)[V]
40.0
Power Supply Voltage (Max.) [V]
32.0
Power Supply Voltage (Min.) [V]
6.3
Iout (Max.)[A]
1.0
Output On Resistance (Typ.)[Ω]
1.35
Number of Motors
3.0
VREF・PWM
-
Current Limit
Yes
High Speed Drive
-
Automotive class
Yes
Operating Temperature (Min.)[°C]
-40
Operating Temperature (Max.)[°C]
125
Package Size [mm]
9.7x6.4 (t=1)
Eigenschaften:
- AEC-Q100 Qualified (Grade 1)
- 1.0A DMOS Half Bridge 6 Circuits
- Three Mode Output Control (High, Low & High Impedance)
- Low Standby Current
- Built-in Protection Diode Against Output Reverse Voltage
- Over Current Protection at VS Supply Stage (OCP)
- Under Load Detection at VS Supply Stage (ULD)
- Over Voltage Protection with OVDSEL Mode at VS Supply Stage (OVP)
- Under Voltage Lock Out at VS Supply Stage (UVLO)
- Thermal Shutdown (TSD), Thermal Warning (TW)
Ressourcen entwerfen
Technische Artikel
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Thermocouples
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- Thermal Resistance
- Precautions When Measuring the Rear of the Package with a Thermocouple
Design Tools
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Packaging & Qualität
Package Information
- Package Information
Manufacturing Data
- Factory Information