BM60213FV-C
1200-V-Hochspannungs-High-Side- und -Low-Side-Treiber

Bei dem BM60213FV-C handelt es sich um einen High- und Low-Side-Treiber-IC, der bis 1200 V mit Bootstrap-Betrieb arbeitet und N-Kanal-Leistungs-MOSFETs und IGBTs ansteuern kann. Eine Unterspannungs-Sperrfunktion (UVLO) ist eingebaut.

Produktdetails

 
Teilenummer | BM60213FV-CE2
Status | Empfohlen
Gehäuse | SSOP-B20W
Einheitenmenge | 2000
Minimale Gehäusemenge | 2000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Automotive

Common Standard

AEC-Q100 (Automotive Grade)

Channel

2

High-side floating supply voltage [V]

1200

Turn-on/off time (Typ.) [ns]

75

Vcc(Min.)[V]

10.0

Vcc(Max.)[V]

24.0

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

Eigenschaften:

  • AEC-Q100 Qualified(Grade 1)
  • High-Side Floating Supply Voltage 1200 V
  • Under Voltage Lockout Function
  • 3.3 V and 5.0 V Input Logic Compatible

Evaluation
Board

 
    • Evaluation Board
    • BM60213FV-EVK001
    • The BM60213FV-EVK001 board can be driving IGBT Power Devices for High-side and Low-side on Half-Bridge application. The BM60213FV-C has Power Supply protections which are the Under-Voltage Lockout (UVLO) function at VCCA and VCCB. The BM60213FV-EVK001 allows designers to evaluate Rohm’s Gate Driver family for various applications.

  • User's Guide Buy

Ressourcen entwerfen

 

Unterlagen

White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs

User's Guide

  • Gate Driver BM60213FV-C Evaluation Board BM60213FV-EVK001

Technische Artikel

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Thermal Resistance

Design Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

Models

  • BM60213FV-C SPICE Model
  • BM60213FV-C Spice Modeling Report

2D/3D/CAD

  • BM60213FV-C Footprint / Symbol
  • SSOP-B20W Footprint / Symbol

Packaging & Qualität

Manufacturing Data

  • Factory Information

Environmental Data

  • REACH SVHC Non-use Declaration