BD9C301FJ-LB(H2)
4,5 V bis 18 V Eingangsleistung, 3,0 A Integrierter MOSFET 1-Kanal Synchron-Invers-DC/DC-Wandler

Für das Produkt wird ein Langzeit-Support im industriellen Markt garantiert. BD9C301FJ ist ein synchroner Abwärtswandler mit integrierten Leistungs-MOSFETs mit niedrigem ON-Widerstand. Mit seinem weiten Eingangsspannungsbereich kann er Stromstärken bis zu 3 A bereitstellen. Der DC/DC-Wandler zur Steuerung des Strommodus zeichnet sich durch ein Hochgeschwindigkeitseinschwingverhalten aus. Auch die Phasenkompensation ist leicht einstellbar.

Produktdetails

 
Teilenummer | BD9C301FJ-LBGH2
Status | Aktiv
Gehäuse | SOP-J8
Einheitenmenge | 250
Minimale Gehäusemenge | 250
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Industrial

ch

1

Integrated FET / Controller

Integrated FET

Topology

Buck

Synchronous / Nonsynchronous

Synchronous

Vin1(Min.)[V]

4.5

Vin1(Max.)[V]

18.0

Vout1(Min.)[V]

0.8

Vout1(Max.)[V]

12.6

Iout1(Max.)[A]

3.0

SW frequency(Max.)[MHz]

0.55

Light Load mode

No

EN

Yes

PGOOD

No

Operating Temperature (Min.)[°C]

Tj=-40

Operating Temperature (Max.)[°C]

Tj=125

Package Size [mm]

4.9x6(t=1.65)

Eigenschaften:

· Produkt mit Langzeit-Support für industrielle Anwendungen
· Synchroner DC/DC-Wandler mit 1 Kanal
· Überstromschutz
· Schutzfunktion für thermische Abschaltung
· Unterspannungsabschaltung
· Kurzschlussschutz
· Fixe Sanftanlauffunktion mit 1 ms

Evaluation
Board

 
    • Evaluation Board
    • BD9C301FJ-EVK-001
    • BD9C301FJ-EVK-001 Evaluation board delivers an output 3.3 volts from an input 4.5 to 18 volts using BD9C301FJ, a synchronous rectification stepdown DC/DC converter integrated circuit, with output current rating of maximum 3A. The output voltage can be set by changing the external parts of circuit and the loop-response characteristics also can be adjusted by the phase compensation circuit.

  • User's Guide Design Data Buy

Ressourcen entwerfen

 

Unterlagen

White Paper

  • Industrial DC/DC Buck Converters BD9x Series
  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs

User's Guide

  • Evaluation Board User's Guide
  • Evaluation Board Data

Application Note

  • PCB Layout for BD9C301FJ-LB(H2)

Reference Design

  • BD9C301FJ-LB(H2) Reference Circuits and Bomlist

Technische Artikel

Schematic Design & Verification

  • Buck DC/DC Converter Recommended Inductor List
  • Calculation of Power Dissipation in Switching Circuit
  • Considering Input Filter to Reduce Conducted Emissions by DCDC Converter
  • Considering Polarity of Power Inductor to Reduce Radiated Emission of DC-DC converter
  • Method for Monitoring Switching Waveform
  • Phase Compensation Design for Current Mode Buck Converter
  • Bootstrap Circuit in the Buck Converter
  • Method for Determining Constants of
  • Power Supply Sequence Circuit with General Purpose Power Supply IC
  • Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter
  • PCB Layout Techniques of Buck Converter
  • Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)
  • Usage of SPICE Macromodel for DC/DC
  • Snubber Circuit for Buck Converter IC
  • Efficiency of Buck Converter
  • Calculation of Power Loss (Synchronous)
  • Inductor Calculation for Buck converter IC
  • Considerations for Power Inductors Used for Buck Converters
  • Capacitor Calculation for Buck converter IC
  • The Important Points of Multi-layer Ceramic Capacitor Used in Buck Converter circuit
  • Resistor Value Table to set Output Voltage of Buck Converter IC
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Thermal Resistance
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • BD9C301FJ-LB(H2) SPICE Model
  • Unencrypted SPICE Model (Inquiry Form)

2D/3D/CAD

  • SOP-J8 Footprint / Symbol
  • SOP-J8 3D STEP Data

Packaging & Qualität

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)