Halbbrückenmodule bestehend aus SiC-DMOSFETs und SiC-SBDs von ROHM.

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Teilenummer | BSM120D12P2C005
Status | Empfohlen
Gehäuse | C
Einheitenmenge | 12
Minimale Gehäusemenge | 12
Gehäusetyp | Corrugated Cardboard
RoHS | Ja


Drain-source Voltage[V]


Drain Current[A]


Total Power Dissipation[W]


Junction Temperature(Max.)[°C]


Storage Temperature (Min.)[°C]


Storage Temperature (Max.)[°C]



Half bridge

Package Size [mm]

122x45.6 (t=17.5)


・Full SiC power module with SiC MOSFET and SiC SBD
・High-speed switching and low switching loss
・Ensured reliability of body diode conduction


    • Drive Board
    • AgileSwitch 2ASC-12A1HP / EDCA2
    • BSM series (1200V, C type)
      Core Driver : 2ASC-12A1HP
      Adapter Board : EDCA2

  • Detail
    • Drive Board
    • BSMGD3C12D24-EVK001
    • This evaluation board, BSMGD3C12D24-EVK001, is a gate driver board for full SiC Modules in C type housing. This evaluation board contains all the necessary components for optimal and safety driving the SiC module.

  • User's Guide Purchase Inquiry
    • Drive Board
    • TAMURA 2DU series
    • For BSM series (1200V, C / E / G type)

  • Detail

Ressourcen entwerfen



White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs

User's Guide

  • Evaluation Board User's Guide for C-type Full SiC Module (BSMGD3C12D24-EVK001)

Technische Artikel

Schematic Design & Verification

  • [NEW]Application Note for SiC Power Devices and Modules
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (SiC Power Device)
  • How to Use Thermal Models
  • Optimized heat sink assembly method for effective heat dissipation
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Simulations (Login Required)

ROHM Solution Simulator is a new web-based electronic circuit simulation tool that can carry out a variety of simulations, from initial development that involves component selection and individual device verification to the system-level verification stage. This makes it possible to quickly and easily implement complete circuit verification of ROHM power devices and ICs, in simulation circuits under close to actual conditions, significantly reducing application development efforts.
  • AC-DC PFC A003: BCM Diode-Bridge-Less VIN=200V IIN=50A
  • AC-DC PFC A008: CCM Diode-Bridge-Less Synchro VIN=200V IIN=50A
  • AC-DC PFC A010: CCM Totem-Pole Synchro VIN=200V IIN=100A
  • AC-DC PFC A017: DCM Diode-Bridge-Less Synchro VIN=200V IIN=50A
  • DC-AC Inverter B001: IH Half-Bridge Inverter Po=10kW
  • DC-AC Inverter B003: Half-Bridge Inverter Vo=200V Io=100A
  • DC-AC Inverter B004: Full-Bridge Inverter Vo=200V Io=100A
  • DC-AC Inverter B005: 1-Phase 3-Wire Inverter Vo=100/200V Po=20kW
  • DC-DC Converter C001: Bi-Directional Converter VH=350V VL=50V IL=200A
  • DC-DC Converter C002: Boost Converter Vo=800V Io=20A
  • DC-DC Converter C003: Boost Converter 2-Phase Vo=800V Io=40A
  • DC-DC Converter C004: Boost Synchro Converter Vo=800V Io=20A
  • DC-DC Converter C008: Buck Synchro Converter Vo=250V Io=100A
  • DC-DC Converter C009: Buck Synchro Converter 2-Phase Vo=250V Io=200A
  • DC-DC Converter C015: Step-Up/Down Converter Vo=400V Io=40A
  • ROHM Solution Simulator Power Device Use's Guide for PFC Circuits


  • BSM120D12P2C005 PLECS Model
  • Circuit Data: DC-AC Full-Bridge PS Inverter Po=15kW
  • BSM120D12P2C005 SPICE Simulation Evaluation Circuit
  • BSM120D12P2C005 SPICE Model
  • BSM120D12P2C005 Thermal Model (lib)
  • How to Create Symbols for PSpice Models
  • Power Module Loss Simulator - 3Phase Inverter
  • Power Module Loss Simulator - Boost Converter
  • Power Module Loss Simulator - Buck Converter

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Inner Structure
  • Taping Information

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • Compliance of the ELV directive
  • Report of SVHC under REACH Regulation

Export Information

  • About Export Regulations