ROHM Product Detail

BSM600D12P4G103
1200V, 567A, Half bridge, Full SiC-Power Module with Trench MOSFET

BSM600D12P4G103 is a half bridge module consisting of SiC-UMOSFET, suitable for motor drive, inverter, converter, photovoltaics, wind power generation, induction heating equipment.

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Produktdetails

 
Teilenummer | BSM600D12P4G103
Status | Empfohlen
Gehäuse | G Type
Gehäusetyp | Corrugated Cardboard
Einheitenmenge | 4
Minimale Gehäusemenge | 4
RoHS | Ja
Product Longevity Program | 10 Years

Spezifikationen:

Drain-source Voltage[V]

1200

Drain Current[A]

567

Total Power Dissipation[W]

1780

Junction Temperature (Max.) [℃]

175

Storage Temperature (Min.) [℃]

-40

Storage Temperature (Max.) [℃]

125

Package

Half-bridge

Package Size [mm]

152.0x62.0 (t=18.0)

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Eigenschaften:

  • Low surge, low switching loss.
  • High-speed switching possible.
  • Reduced temperature dependance.

Referenzdesign / Anwendungsevaluierungskit

 
    • Drive Board - BSMGD3G12D24-EVK001
    • This evaluation board, BSMGD3G12D24-EVK001, is a gate driver board for full SiC Modules with the 3rd / 4th Generation SiC-MOSFET in G and E type housing. This evaluation board contains all the necessary components for optimal and safety driving the SiC module.

  • User's Guide
    • Snubber Module - MGSM1D72J2-145MH16
    • Snubber Module for BSM series (1200V, E / G type)

Produktvideo & Katalog

 
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