SCS206AG (In Entwicklung)
SiC SBD

Reduzierte Schaltverluste, Schnellschaltung ermöglicht. (2-Pin-Gehäuse)

Data Sheet Kaufen
* Dieses Produkt entspricht der Standardqualifizierung.
Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.
Data Sheet Kaufen

Produktdetails

 
Teilenummer | SCS206AGC17
Status | In Entwicklung
Gehäuse | TO-220ACG
Einheitenmenge | 1000
Minimale Gehäusemenge | 50
Gehäusetyp | Tube
RoHS | Ja

Spezifikationen:

Grade

Standard

Reverse Voltage[V]

650

Continuous Forward Current[A]

6.0

Total Power Dissipation[W]

51

Junction Temperature(Max.)[°C]

175

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

175

Package Size [mm]

9.8x15.37 (t=4.71)

Eigenschaften:

・Kürzere Wiederherstellungszeit
・Geringere Temperaturabhängigkeit
・Umschalten mit Höchstgeschwindigkeit möglich

Ressourcen entwerfen

 

Unterlagen

White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs

Technische Artikel

Schematic Design & Verification

  • [NEW]Application Note for SiC Power Devices and Modules
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (SiC Power Device)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • How to Use Thermal Models
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • SCS206AG SPICE Simulation Evaluation Circuit
  • SCS206AG SPICE Model
  • SCS206AG Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • Compliance of the ELV directive
  • Report of SVHC under REACH Regulation

Export Information

  • About Export Administration Regulations (EAR)