2SAR567F3 (In Entwicklung)
Kleiner PNP -2,5A -120V Mittelleistungstransistor mit exzellenter Wärmeleitfähigkeit

Der 2SAR567F3 ist ein Mittelleistungstransistor mit niedriger VCE(sat), geeignet für Niederfrequenzverstärker. HUML2020L3 (DFN2020-3S) ist ein kleines bleifreies oberflächenmontierbares Gehäuse mit ausgezeichneter thermischer und elektrischer Leitfähigkeit.

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Produktdetails

 
Teilenummer | 2SAR567F3TR
Status | In Entwicklung
Gehäuse | HUML2020L3
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

DFN2020-3S

Package Size [mm]

2x2 (t=0.65)

Number of terminal

3

Polarity

PNP

Collector Power dissipation PC[W]

1

Collector-Emitter voltage VCEO1[V]

-120.0

Collector current Io(Ic) [A]

-2.5

hFE

120 to 390

hFE (Min.)

120

hFE (Max.)

390

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

  • Suitable for Middle Power Driver.
  • Low VCE(sat) VCE(sat)=-200mV (Max.) . (IC/IB=-800mA/-80mA)
  • High collector current. IC=-2.5A(max), ICP=-5A(max)
  • Leadless small SMD package (HUML2020L3) Excellent thermal and electrical conductivity.
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Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • How to Create Symbols for PSpice Models
  • 2SAR567F3 SPICE Model

Characteristics Data

  • 2SAR567F3 Thermal Resistance

Packaging & Qualität

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations