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- 2SAR567F3 SPICE Model
Characteristics Data
- 2SAR567F3 Thermal Resistance
2SAR567F3
2SAR567F3 (Neues Produkt)
Kleiner PNP -2,5A -120V Mittelleistungstransistor mit exzellenter Wärmeleitfähigkeit
Der 2SAR567F3 ist ein Mittelleistungstransistor mit niedriger VCE(sat), geeignet für Niederfrequenzverstärker. HUML2020L3 (DFN2020-3S) ist ein kleines bleifreies oberflächenmontierbares Gehäuse mit ausgezeichneter thermischer und elektrischer Leitfähigkeit.
Data Sheet
* Dieses Produkt entspricht der Standardqualifizierung.
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Produktdetails
Spezifikationen:
Grade
Standard
Package Code
DFN2020-3S
Package Size[mm]
2.0x2.0 (t=0.6)
Number of terminal
3
Polarity
PNP
Collector Power dissipation PC[W]
1
Collector-Emitter voltage VCEO1[V]
-120.0
Collector current Io(Ic) [A]
-2.5
hFE
120 to 390
hFE (Min.)
120
hFE (Max.)
390
Mounting Style
Surface mount
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
Eigenschaften:
- Suitable for Middle Power Driver.
- Low VCE(sat) VCE(sat)=-200mV (Max.) . (IC/IB=-800mA/-80mA)
- High collector current. IC=-2.5A(max), ICP=-5A(max)
- Leadless small SMD package (HUML2020L3) Excellent thermal and electrical conductivity.
Ressourcen entwerfen
Technische Artikel
Schematic Design & Verification
- Temperature derating method for Safe Operating Area (SOA)
- Calculation of Power Dissipation in Switching Circuit
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Thermocouples
- What is a Thermal Model? (Transistor)
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Design Tools
Simulations (Login Required)
- Method for Exporting Circuit Data (ROHM Solution Simulator)
Models
- 2SAR567F3 SPICE Model
Characteristics Data
- 2SAR567F3 Thermal Resistance
Packaging & Qualität
Package Information
- Package Dimensions
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Environmental Data
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations