QS6Z5
NPN+PNP-Treibertransistor

Geräte mit zwei integrierten Transistoren sind in extrem kompakten Gehäusen verfügbar. Sie sind für verschiedene Anwendungen geeignet wie beispielsweise für differentielle Vorverstärker-Verstärkungsschaltungen, Hochfrequenz-Oszillatoren, Treiber-ICs usw.

Data Sheet Kaufen *
* Dieses Produkt entspricht der Standardqualifizierung.
Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.

Produktdetails

 
Teilenummer | QS6Z5TR
Status | Empfohlen
Gehäuse | TSMT6
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

SOT-457T

JEITA Package

SC-95

Package Size[mm]

2.9x2.8 (t=1.0)

Number of terminal

6

Polarity

NPN+PNP

Collector-Emitter voltage VCEO1[V]

50.0

Collector current Io(Ic) [A]

1.0

Collector-Emitter voltage VCEO2[V]

-50.0

Collector current(continuous) IC2[A]

-1.0

hFE

180 to 450

hFE (Min.)

180

hFE (Max.)

450

Mounting Style

Surface mount

Equivalent (Single Part)

2SAR553P / 2SCR553P

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

· Ultrakompakter komplexer Bipolartransistor
· Für Vorverstärker
· Kleines, oberflächenmontierbares Gehäuse
· Bleifrei/RoHS-konform

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

Models

  • QS6Z5 SPICE Model
  • QS6Z5 Thermal Model (lib)

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • TSMT6_TR Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations