DTC143EUB
NPN-Digitaltransistor (mit integrierten Widerständen)

Dies sind die Standardprodukte der „digitale Transistoren”-Reihe, die ROHM erfunden und weltweit zuerst vermarktet hat.

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Produktdetails

 
Teilenummer | DTC143EUBTL
Status | Aktiv
Gehäuse | UMT3F
Einheitenmenge | 3000
Minimale Gehäusemenge | 3000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

SOT-323FL

JEITA Package

SC-85

Package Size[mm]

2.0x2.1 (t=0.9)

Number of terminal

3

Polarity

NPN

Supply voltage VCC 1[V]

50.0

Collector current Io (Ic) [A]

0.1

Input resistance R1 1 [kΩ]

4.7

Emitter base Resistance R2 1 [kΩ]

4.7

Power Dissipation (PD)[W]

0.2

Mounting Style

Surface mount

GI hFE

20 to

Output Current [A]

0.1

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

  • Built-In Biasing Resistors, R1 = R2 = 4.7kΩ
  • Built-in bias resistors enable the configuration of an inverter circuit without connecting external input resistors (see inner circuit) .
  • Only the on/off conditions need to be set for operation, making the circuit design easy.
  • Complementary PNP Types: DTA143E series

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

Models

  • DTC143EUB SPICE Model
  • DTC143EUB Thermal Model (lib)

2D/3D/CAD

  • UMT3F STEP Data

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations