SMLEN3WBC8W
EXCELED™-Serie Mini-Chip-LED
SMLEN3WBC8W
SMLEN3WBC8W
EXCELED™-Serie Mini-Chip-LED
ROHM's Chip-LED-Aufstellung beinhaltet die Standardausführung, Obenansicht, Seitenansicht und Inversmontage.
Produktdetails
Spezifikationen:
Package Type
Mini-mold
LED Type
Standard
Application
Smart Phone & Mobile
Package size[mm]
1.6x0.8 (t=0.36)
Emitting color
White
Luminous Intensity(Single)(Typ.)[mcd]
120
Number of Brightness Rank
3
Chromaticity coordinates(x,y)
(0.30, 0.30)
Forward Voltage VF (Typ.) [V]
2.9
IF @ VF [mA]
5
Chip Structure
InGaN
Power Dissipation [mW]
33
Operating Temperature[°C]
-40 to 85
Storage Temperature [°C]
-40 to 100
Eigenschaften:
・0603(1608mm) size・Ultra-thin packagetype chip LED
